Moisture diffusion in BCB resins used for MEMS packaging

A. Tetelin, C. Pellet, J.-Y. Delétage, B. Carbonne, Y. Danto. Moisture diffusion in BCB resins used for MEMS packaging. Microelectronics Reliability, 43(9-11):1939-1944, 2003. [doi]

Abstract

Abstract is missing.