Hiren D. Thacker, James D. Meindl. Prospects for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects. In Scott Davidson, Anne Gattiker, editors, 2006 IEEE International Test Conference, ITC 2006, Santa Clara, CA, USA, October 22-27, 2006. pages 1-7, IEEE, 2006. [doi]
Abstract is missing.