Efficient 3D Modelling for Extraction of Interconnect Capacitances in Deep Submicron Dense Layouts - researchr publication authors

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A. Toulouse, David Bernard, Christian Landrault, Pascal Nouet. Efficient 3D Modelling for Extraction of Interconnect Capacitances in Deep Submicron Dense Layouts. In 1999 Design, Automation and Test in Europe (DATE 99), 9-12 March 1999, Munich, Germany. pages 576-580, IEEE Computer Society, 1999. [doi]

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