Efficient 3D Modelling for Extraction of Interconnect Capacitances in Deep Submicron Dense Layouts

A. Toulouse, David Bernard, Christian Landrault, Pascal Nouet. Efficient 3D Modelling for Extraction of Interconnect Capacitances in Deep Submicron Dense Layouts. In 1999 Design, Automation and Test in Europe (DATE 99), 9-12 March 1999, Munich, Germany. pages 576-580, IEEE Computer Society, 1999. [doi]

@inproceedings{ToulouseBLN99,
  title = {Efficient 3D Modelling for Extraction of Interconnect Capacitances in Deep Submicron Dense Layouts},
  author = {A. Toulouse and David Bernard and Christian Landrault and Pascal Nouet},
  year = {1999},
  url = {http://csdl.computer.org/comp/proceedings/date/1999/0078/00/00780576abs.htm},
  tags = {layout, Pascal},
  researchr = {https://researchr.org/publication/ToulouseBLN99},
  cites = {0},
  citedby = {0},
  pages = {576-580},
  booktitle = {1999 Design, Automation and Test in Europe (DATE  99), 9-12 March 1999, Munich, Germany},
  publisher = {IEEE Computer Society},
  isbn = {0-7695-0078-1},
}