Through-Silicon Via Planning in 3-D Floorplanning

Ming-Chao Tsai, Ting-Chi Wang, Ting Ting Hwang. Through-Silicon Via Planning in 3-D Floorplanning. IEEE Trans. VLSI Syst., 19(8):1448-1457, 2011. [doi]

Authors

Ming-Chao Tsai

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Ting-Chi Wang

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Ting Ting Hwang

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