Ming-Chao Tsai, Ting-Chi Wang, Ting Ting Hwang. Through-Silicon Via Planning in 3-D Floorplanning. IEEE Trans. VLSI Syst., 19(8):1448-1457, 2011. [doi]
@article{TsaiWH11,
title = {Through-Silicon Via Planning in 3-D Floorplanning},
author = {Ming-Chao Tsai and Ting-Chi Wang and Ting Ting Hwang},
year = {2011},
doi = {10.1109/TVLSI.2010.2050012},
url = {http://dx.doi.org/10.1109/TVLSI.2010.2050012},
researchr = {https://researchr.org/publication/TsaiWH11},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {19},
number = {8},
pages = {1448-1457},
}