Tomohiro Tsuruya, Musashi Danseko, Katsuhiko Sasaki, Shinya Honda, Ryo Takeda. Process monitoring of deep drawing using machine learning. In IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2019, Hong Kong, SAR, China, July 8-12, 2019. pages 1227-1232, IEEE, 2019. [doi]
@inproceedings{TsuruyaDSHT19,
title = {Process monitoring of deep drawing using machine learning},
author = {Tomohiro Tsuruya and Musashi Danseko and Katsuhiko Sasaki and Shinya Honda and Ryo Takeda},
year = {2019},
doi = {10.1109/AIM.2019.8868512},
url = {https://doi.org/10.1109/AIM.2019.8868512},
researchr = {https://researchr.org/publication/TsuruyaDSHT19},
cites = {0},
citedby = {0},
pages = {1227-1232},
booktitle = {IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2019, Hong Kong, SAR, China, July 8-12, 2019},
publisher = {IEEE},
isbn = {978-1-7281-2493-3},
}