Process monitoring of deep drawing using machine learning

Tomohiro Tsuruya, Musashi Danseko, Katsuhiko Sasaki, Shinya Honda, Ryo Takeda. Process monitoring of deep drawing using machine learning. In IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2019, Hong Kong, SAR, China, July 8-12, 2019. pages 1227-1232, IEEE, 2019. [doi]

Abstract

Abstract is missing.