Thermal-aware CMOS: Challenges for future technology and design evolutions

Ken Uchida, Tsunaki Takahashi. Thermal-aware CMOS: Challenges for future technology and design evolutions. In 46th European Solid-State Device Research Conference, ESSDERC 2016, Lausanne, Switzerland, September 12-15, 2016. pages 150-153, IEEE, 2016. [doi]

@inproceedings{UchidaT16,
  title = {Thermal-aware CMOS: Challenges for future technology and design evolutions},
  author = {Ken Uchida and Tsunaki Takahashi},
  year = {2016},
  doi = {10.1109/ESSDERC.2016.7599609},
  url = {http://dx.doi.org/10.1109/ESSDERC.2016.7599609},
  researchr = {https://researchr.org/publication/UchidaT16},
  cites = {0},
  citedby = {0},
  pages = {150-153},
  booktitle = {46th European Solid-State Device Research Conference, ESSDERC 2016, Lausanne, Switzerland, September 12-15, 2016},
  publisher = {IEEE},
  isbn = {978-1-5090-2969-3},
}