Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas. Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-7, IEEE, 2013. [doi]
@inproceedings{VianneBFPCGFCEHT13,
title = {Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments},
author = {Benjamin Vianne and Pierre Bar and Vincent Fiori and Sebastien Petitdidier and Norbert Chevrier and Sébastien Gallois-Garreignot and Alexis Farcy and Pascal Chausse and Stephanie Escoubas and Nicolas Hotellier and Olivier Thomas},
year = {2013},
doi = {10.1109/3DIC.2013.6702332},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702332},
researchr = {https://researchr.org/publication/VianneBFPCGFCEHT13},
cites = {0},
citedby = {0},
pages = {1-7},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}