Pre-bond testing of the silicon interposer in 2.5D ICs - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty. Pre-bond testing of the silicon interposer in 2.5D ICs. In Luca Fanucci, Jürgen Teich, editors, 2016 Design, Automation & Test in Europe Conference & Exhibition, DATE 2016, Dresden, Germany, March 14-18, 2016. pages 978-983, IEEE, 2016. [doi]

This author has not been identified. Look up 'Ran Wang' in GoogleThis author has not been identified. Look up 'Zipeng Li' in GoogleThis author has not been identified. Look up 'Sukeshwar Kannan' in GoogleThis author has not been identified. Look up 'Krishnendu Chakrabarty' in Google

runs on WebDSL