The following publications are possibly variants of this publication:
- Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICsRan Wang, Krishnendu Chakrabarty, Bill Eklow. ats 2013: 147-152 [doi]
- Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICsRan Wang, Krishnendu Chakrabarty, Bill Eklow. tcad, 33(9):1410-1423, 2014. [doi]
- Built-in self-test for interposer-based 2.5D ICsRan Wang, Krishnendu Chakrabarty, Sudipta Bhawmik. iccd 2014: 181-188 [doi]
- Multicast Test Architecture and Test Scheduling for Interposer-Based 2.5D ICsShengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori. ats 2016: 86-91 [doi]
- Optimized Pre-bond Test Methodology for Silicon Interposer TestingKatherine Shu-Min Li, Sying-Jyan Wang, Jia-Lin Wu, Cheng-You Ho, Yingchieh Ho, Ruei-Ting Gu, Bo-Chuan Cheng. ats 2014: 13-18 [doi]
- Efficient test length reduction techniques for interposer-based 2.5D ICsShyue-Kung Lu, Huai-Min Li, Masaki Hashizume, Jin-Hua Hong, Zheng-Ru Tsai. vlsi-dat 2014: 1-4 [doi]
- Prebond Testing and Test-Path Design for the Silicon Interposer in 2.5-D ICsRan Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty. tcad, 36(8):1406-1419, 2017. [doi]