Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty. Pre-bond testing of the silicon interposer in 2.5D ICs. In Luca Fanucci, Jürgen Teich, editors, 2016 Design, Automation & Test in Europe Conference & Exhibition, DATE 2016, Dresden, Germany, March 14-18, 2016. pages 978-983, IEEE, 2016. [doi]
Abstract is missing.