Hsiang-Ting Wen, Yu-Jie Cai, Yang Hsu, Yao-Wen Chang. Via-based Redistribution Layer Routing for InFO Packages with Irregular Pad Structures. In 57th ACM/IEEE Design Automation Conference, DAC 2020, San Francisco, CA, USA, July 20-24, 2020. pages 1-6, IEEE, 2020. [doi]
@inproceedings{WenCHC20,
title = {Via-based Redistribution Layer Routing for InFO Packages with Irregular Pad Structures},
author = {Hsiang-Ting Wen and Yu-Jie Cai and Yang Hsu and Yao-Wen Chang},
year = {2020},
doi = {10.1109/DAC18072.2020.9218619},
url = {https://doi.org/10.1109/DAC18072.2020.9218619},
researchr = {https://researchr.org/publication/WenCHC20},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {57th ACM/IEEE Design Automation Conference, DAC 2020, San Francisco, CA, USA, July 20-24, 2020},
publisher = {IEEE},
isbn = {978-1-7281-1085-1},
}