The following publications are possibly variants of this publication:
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- Obstacle-Avoiding Multiple Redistribution Layer Routing with Irregular StructuresYen-Ting Chen, Yao-Wen Chang. iccad 2022: 65 [doi]
- Simultaneous Pre- and Free-assignment Routing for Multiple Redistribution Layers with Irregular ViasYu-Jie Cai, Yang Hsu, Yao-Wen Chang. dac 2021: 1147-1152 [doi]
- Unified Redistribution Layer Routing for 2.5D IC PackagesChun-Han Chiang, Fu-Yu Chuang, Yao-Wen Chang. aspdac 2020: 331-337 [doi]
- Redistribution layer routing for wafer-level integrated fan-out package-on-packagesTing-Chou Lin, Chia-Chih Chi, Yao-Wen Chang. iccad 2017: 561-568 [doi]
- Multi-Pads, Single Layer Power Net Routing in VLSI CircuitsH. Cai. dac 1988: 183-188 [doi]