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Eric Wong, Sung Kyu Lim. Whitespace redistribution for thermal via insertion in 3D stacked ICs. In 25th International Conference on Computer Design, ICCD 2007, 7-10 October 2007, Lake Tahoe, CA, USA, Proceedings. pages 267-272, IEEE, 2007. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Thermal-aware Steiner routing for 3D stacked ICsMohit Pathak, Sung Kyu Lim. iccad 2007: 205-211 [doi] Slew-aware buffer insertion for through-silicon-via-based 3D ICsYoung-Joon Lee, Inki Hong, Sung Kyu Lim. cicc 2012: 1-8 [doi]
The following publications are possibly variants of this publication: