TSV stress aware timing analysis with applications to 3D-IC layout optimization - researchr publication authors

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Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee, Sung Kyu Lim, David Z. Pan. TSV stress aware timing analysis with applications to 3D-IC layout optimization. In Sachin S. Sapatnekar, editor, Proceedings of the 47th Design Automation Conference, DAC 2010, Anaheim, California, USA, July 13-18, 2010. pages 803-806, ACM, 2010. [doi]

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