TSV stress aware timing analysis with applications to 3D-IC layout optimization

Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee, Sung Kyu Lim, David Z. Pan. TSV stress aware timing analysis with applications to 3D-IC layout optimization. In Sachin S. Sapatnekar, editor, Proceedings of the 47th Design Automation Conference, DAC 2010, Anaheim, California, USA, July 13-18, 2010. pages 803-806, ACM, 2010. [doi]

@inproceedings{YangALLP10,
  title = {TSV stress aware timing analysis with applications to 3D-IC layout optimization},
  author = {Jae-Seok Yang and Krit Athikulwongse and Young-Joon Lee and Sung Kyu Lim and David Z. Pan},
  year = {2010},
  doi = {10.1145/1837274.1837476},
  url = {http://doi.acm.org/10.1145/1837274.1837476},
  tags = {optimization, layout, analysis, context-aware},
  researchr = {https://researchr.org/publication/YangALLP10},
  cites = {0},
  citedby = {0},
  pages = {803-806},
  booktitle = {Proceedings of the 47th Design Automation Conference, DAC 2010, Anaheim, California, USA, July 13-18, 2010},
  editor = {Sachin S. Sapatnekar},
  publisher = {ACM},
  isbn = {978-1-4503-0002-5},
}