Bo Yi, Haimeng Huang, Haoran Hu, MouFu Kong, Yilin Guo, Wenkun Shi, Junji Cheng, Hongqiang Yang. Comprehensive Comparison of Temperature Performances for SiC Trench MOSFET with Integrated Side-wall Schottky Diode and Heterojunction. In 15th IEEE International Conference on ASIC, ASICON 2023, Nanjing, China, October 24-27, 2023. pages 1-4, IEEE, 2023. [doi]
@inproceedings{YiHHKGSCY23,
title = {Comprehensive Comparison of Temperature Performances for SiC Trench MOSFET with Integrated Side-wall Schottky Diode and Heterojunction},
author = {Bo Yi and Haimeng Huang and Haoran Hu and MouFu Kong and Yilin Guo and Wenkun Shi and Junji Cheng and Hongqiang Yang},
year = {2023},
doi = {10.1109/ASICON58565.2023.10396464},
url = {https://doi.org/10.1109/ASICON58565.2023.10396464},
researchr = {https://researchr.org/publication/YiHHKGSCY23},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {15th IEEE International Conference on ASIC, ASICON 2023, Nanjing, China, October 24-27, 2023},
publisher = {IEEE},
isbn = {979-8-3503-1298-0},
}