Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing

Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Tadahiro Kuroda, Masayuki Mizuno. Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. In IEEE International Solid-State Circuits Conference, ISSCC 2009, Digest of Technical Papers, San Francisco, CA, USA, 8-12 February, 2009. pages 470-471, IEEE, 2009. [doi]

@inproceedings{YoshidaNNNMTKM09,
  title = {Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing},
  author = {Yoichi Yoshida and Koichi Nose and Yoshihiro Nakagawa and Koichiro Noguchi and Yasuhiro Morita and Masamoto Tago and Tadahiro Kuroda and Masayuki Mizuno},
  year = {2009},
  doi = {10.1109/ISSCC.2009.4977512},
  url = {http://dx.doi.org/10.1109/ISSCC.2009.4977512},
  researchr = {https://researchr.org/publication/YoshidaNNNMTKM09},
  cites = {0},
  citedby = {0},
  pages = {470-471},
  booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2009, Digest of Technical Papers, San Francisco, CA, USA, 8-12 February, 2009},
  publisher = {IEEE},
  isbn = {978-1-4244-3458-9},
}