In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis

Jhih-Wei You, Shi-Yu Huang, Yu-Hsiang Lin, Meng-Hsiu Tsai, Ding-Ming Kwai, Yung-Fa Chou, Cheng-Wen Wu. In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis. IEEE Trans. VLSI Syst., 21(3):443-453, 2013. [doi]

Abstract

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