Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

C. Yuan, W. D. van Driel, R. B. R. van Silfhout, O. van der Sluis, R. A. B. Engelen, L. J. Ernst, F. van Keulen, G. Q. Zhang. Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability, 46(9-11):1679-1684, 2006. [doi]

This author has not been identified. Look up 'C. Yuan' in GoogleThis author has not been identified. Look up 'W. D. van Driel' in GoogleThis author has not been identified. Look up 'R. B. R. van Silfhout' in GoogleThis author has not been identified. Look up 'O. van der Sluis' in GoogleThis author has not been identified. Look up 'R. A. B. Engelen' in GoogleThis author has not been identified. Look up 'L. J. Ernst' in GoogleThis author has not been identified. Look up 'F. van Keulen' in GoogleThis author has not been identified. Look up 'G. Q. Zhang' in Google

runs on WebDSL