C. Yuan, W. D. van Driel, R. B. R. van Silfhout, O. van der Sluis, R. A. B. Engelen, L. J. Ernst, F. van Keulen, G. Q. Zhang. Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability, 46(9-11):1679-1684, 2006. [doi]
@article{YuanDSSEEKZ06,
title = {Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions},
author = {C. Yuan and W. D. van Driel and R. B. R. van Silfhout and O. van der Sluis and R. A. B. Engelen and L. J. Ernst and F. van Keulen and G. Q. Zhang},
year = {2006},
doi = {10.1016/j.microrel.2006.07.054},
url = {http://dx.doi.org/10.1016/j.microrel.2006.07.054},
tags = {analysis, C++},
researchr = {https://researchr.org/publication/YuanDSSEEKZ06},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {46},
number = {9-11},
pages = {1679-1684},
}