Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions

C. Yuan, W. D. van Driel, R. B. R. van Silfhout, O. van der Sluis, R. A. B. Engelen, L. J. Ernst, F. van Keulen, G. Q. Zhang. Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability, 46(9-11):1679-1684, 2006. [doi]

Abstract

Abstract is missing.