Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions - researchr publication related

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C. Yuan, W. D. van Driel, R. B. R. van Silfhout, O. van der Sluis, R. A. B. Engelen, L. J. Ernst, F. van Keulen, G. Q. Zhang. Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability, 46(9-11):1679-1684, 2006. [doi]

The following publications are possibly variants of this publication:

Analysis of Cu/low-k bond pad delamination by using a novel failure indexM. A. J. van Gils, O. van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken. mr, 47(2-3):179-186, 2007. [doi]

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