A Novel Wafer Manipulation Method for Yield Improvement and Cost Reduction of 3D Wafer-on-Wafer Stacked ICs

Bei Zhang, Vishwani D. Agrawal. A Novel Wafer Manipulation Method for Yield Improvement and Cost Reduction of 3D Wafer-on-Wafer Stacked ICs. J. Electronic Testing, 30(1):57-75, 2014. [doi]

Authors

Bei Zhang

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Vishwani D. Agrawal

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