A Novel Wafer Manipulation Method for Yield Improvement and Cost Reduction of 3D Wafer-on-Wafer Stacked ICs

Bei Zhang, Vishwani D. Agrawal. A Novel Wafer Manipulation Method for Yield Improvement and Cost Reduction of 3D Wafer-on-Wafer Stacked ICs. J. Electronic Testing, 30(1):57-75, 2014. [doi]

Abstract

Abstract is missing.