Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives - researchr publication authors

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Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi. Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives. In Jörg Henkel, editor, The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013. pages 371-378, IEEE/ACM, 2013. [doi]

This author has not been identified. Look up 'Chun Zhang' in GoogleThis author has not been identified. Look up 'Moongon Jung' in GoogleThis author has not been identified. Look up 'Sung Kyu Lim' in GoogleThis author has not been identified. Look up 'Yiyu Shi' in Google

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