Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi. Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives. In Jörg Henkel, editor, The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013. pages 371-378, IEEE/ACM, 2013. [doi]
@inproceedings{ZhangJLS13-0,
title = {Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives},
author = {Chun Zhang and Moongon Jung and Sung Kyu Lim and Yiyu Shi},
year = {2013},
url = {http://dl.acm.org/citation.cfm?id=2561903},
researchr = {https://researchr.org/publication/ZhangJLS13-0},
cites = {0},
citedby = {0},
pages = {371-378},
booktitle = {The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013},
editor = {Jörg Henkel},
publisher = {IEEE/ACM},
isbn = {978-1-4799-1069-4},
}