Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi. Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives. In Jörg Henkel, editor, The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013. pages 371-378, IEEE/ACM, 2013. [doi]
Abstract is missing.