Fanchen Zhang, Yi Sun, Xi Shen, Kundan Nepal, Jennifer Dworak, Theodore W. Manikas, Ping Gui, R. Iris Bahar, Al Crouch, John C. Potter. Using Existing Reconfigurable Logic in 3D Die Stacks for Test. In 25th IEEE North Atlantic Test Workshop, NATW 2016, Providence, RI, USA, May 9-11, 2016. pages 46-52, IEEE, 2016. [doi]
@inproceedings{ZhangSSNDMGBCP16,
title = {Using Existing Reconfigurable Logic in 3D Die Stacks for Test},
author = {Fanchen Zhang and Yi Sun and Xi Shen and Kundan Nepal and Jennifer Dworak and Theodore W. Manikas and Ping Gui and R. Iris Bahar and Al Crouch and John C. Potter},
year = {2016},
doi = {10.1109/NATW.2016.15},
url = {http://doi.ieeecomputersociety.org/10.1109/NATW.2016.15},
researchr = {https://researchr.org/publication/ZhangSSNDMGBCP16},
cites = {0},
citedby = {0},
pages = {46-52},
booktitle = {25th IEEE North Atlantic Test Workshop, NATW 2016, Providence, RI, USA, May 9-11, 2016},
publisher = {IEEE},
isbn = {978-1-4673-8949-5},
}