Integrated Thermal Analysis for Processing In Die-Stacking Memory - researchr publication authors

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Yuxiong Zhu, Borui Wang, Dong Li, Jishen Zhao. Integrated Thermal Analysis for Processing In Die-Stacking Memory. In Bruce Jacob, editor, Proceedings of the Second International Symposium on Memory Systems, MEMSYS 2016, Alexandria, VA, USA, October 3-6, 2016. pages 402-414, ACM, 2016. [doi]

This author has not been identified. Look up 'Yuxiong Zhu' in GoogleThis author has not been identified. Look up 'Borui Wang' in GoogleThis author has not been identified. Look up 'Dong Li' in GoogleThis author has not been identified. Look up 'Jishen Zhao' in Google

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