Yuxiong Zhu, Borui Wang, Dong Li, Jishen Zhao. Integrated Thermal Analysis for Processing In Die-Stacking Memory. In Bruce Jacob, editor, Proceedings of the Second International Symposium on Memory Systems, MEMSYS 2016, Alexandria, VA, USA, October 3-6, 2016. pages 402-414, ACM, 2016. [doi]
@inproceedings{ZhuWLZ16,
title = {Integrated Thermal Analysis for Processing In Die-Stacking Memory},
author = {Yuxiong Zhu and Borui Wang and Dong Li and Jishen Zhao},
year = {2016},
doi = {10.1145/2989081.2989093},
url = {http://doi.acm.org/10.1145/2989081.2989093},
researchr = {https://researchr.org/publication/ZhuWLZ16},
cites = {0},
citedby = {0},
pages = {402-414},
booktitle = {Proceedings of the Second International Symposium on Memory Systems, MEMSYS 2016, Alexandria, VA, USA, October 3-6, 2016},
editor = {Bruce Jacob},
publisher = {ACM},
isbn = {978-1-4503-4305-3},
}