Yuxiong Zhu, Borui Wang, Dong Li, Jishen Zhao. Integrated Thermal Analysis for Processing In Die-Stacking Memory. In Bruce Jacob, editor, Proceedings of the Second International Symposium on Memory Systems, MEMSYS 2016, Alexandria, VA, USA, October 3-6, 2016. pages 402-414, ACM, 2016. [doi]
Abstract is missing.