Abstract is missing.
- Is overlay error more important than interconnect variations in double patterning?Kwangok Jeong, Andrew B. Kahng, Rasit Onur Topaloglu. 3-10 [doi]
- OIL: a nano-photonics optical interconnect library for a new photonic networks-on-chip architectureDuo Ding, David Z. Pan. 11-18 [doi]
- Closed-form solution for timing analysis of process variations on SWCNT interconnectPeng Sun, Rong Luo. 19-26 [doi]
- Honeycomb-structured computational interconnects and their scalable extension to spherical domainsJoseph B. Cessna, Thomas R. Bewley. 27-36 [doi]
- Using circuit structural analysis techniques for networks in systems biologySherief Reda. 37-44 [doi]
- A pre-placement net length estimation technique for mixed-size circuitsBahareh Fathi, Laleh Behjat, Logan M. Rakai. 45-52 [doi]
- Floorplan-based FPGA interconnect power estimation in DSP circuitsRuzica Jevtic, Carlos Carreras, Vukasin Pejovic. 53-60 [doi]
- Prediction of high-performance on-chip global interconnectionYulei Zhang, Xiang Hu, Alina Deutsch, A. Ege Engin, James F. Buckwalter, Chung-Kuan Cheng. 61-68 [doi]
- On the bound of time-domain power supply noise based on frequency-domain target impedanceXiang Hu, Wenbo Zhao, Peng Du, Yulei Zhang, Amirali Shayan Arani, Christopher Pan, A. Ege Engin, Chung-Kuan Cheng. 69-76 [doi]
- From 3D circuit technologies and data structures to interconnect predictionRobert Fischbach, Jens Lienig, Tilo Meister. 77-84 [doi]
- Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICsDae-Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim. 85-92 [doi]
- Predicting the worst-case voltage violation in a 3D power networkWanping Zhang, Wenjian Yu, Xiang Hu, Amirali Shayan Arani, A. Ege Engin, Chung-Kuan Cheng. 93-98 [doi]
- Integrated interlayer via planning and pin assignment for 3D ICsXu He, Sheqin Dong, Xianlong Hong, Satoshi Goto. 99-104 [doi]
- Graphene based nanomaterials for VLSI interconnect and energy-storage applicationsKaustav Banerjee. 105-106 [doi]
- Multiband RF-interconnect for reconfigurable network-on-chip communicationsJason Cong, Mau-Chung Frank Chang, Glenn Reinman, Sai-Wang Tam. 107-108 [doi]
- Performance comparison of cu/low-k, carbon nanotube, and optics for on-chip and off-chip interconnectsKrishna Saraswat. 111-112 [doi]