Journal: IEEE Design & Test of Computers

Volume 23, Issue 2

85 -- 0Kwang-Ting (Tim) Cheng. Dealing with early life failures
86 -- 87Phil Nigh. Guest Editor s Introduction: Evolving Methods for Detecting and Handling Reliability Defects
88 -- 98Mohd Fairuz Zakaria, Zainal Abu Kassim, Melanie Po-Leen Ooi, Serge N. Demidenko. Reducing Burn-in Time through High-Voltage Stress Test and Weibull Statistical Analysis
100 -- 109Ritesh P. Turakhia, W. Robert Daasch, Joel Lurkins, Brady Benware. Changing Test and Data Modeling Requirements for Screening Latent Defects as Statistical Outliers
110 -- 116Thomas S. Barnett, Matt Grady, Kathleen G. Purdy, Adit D. Singh. Combining Negative Binomial and Weibull Distributions for Yield and Reliability Prediction
118 -- 126John M. Carulli Jr., Thomas J. Anderson. The Impact of Multiple Failure Modes on Estimating Product Field Reliability
128 -- 136Kaushik Roy, T. M. Mak, Kwang-Ting (Tim) Cheng. Test Consideration for Nanometer-Scale CMOS Circuits
138 -- 146Selahattin Sayil. Optical Contactless Probing: An All-Silicon, Fully Optical Approach
148 -- 158Jérôme Chevalier, Maxime de Nanclas, Luc Filion, Olivier Benny, Mathieu Rondonneau, Guy Bois, El Mostapha Aboulhamid. A SystemC Refinement Methodology for Embedded Software
160 -- 161Brian Bailey. Was it worth the wait? Yes!
162 -- 163Scott Davidson. An insider s look at microprocessor design
164 -- 166Carol Stolicny. ITC 2005 panels
167 -- 0Sandip Kundu. TTTC technical forum honoring Sudhakar M. Reddy
168 -- 171Kartikeya Mayaram. CEDA Currents
175 -- 0. TTTC Newsletter
176 -- 0Burnell West. Making more out of open-source tools