| 4 | -- | 5 | David S. Kung, Yuan Xie. Guest Editors Introduction: Opportunities and Challenges of 3D Integration |
| 6 | -- | 14 | Philip G. Emma, Eren Kursun. Opportunities and Challenges for 3D Systems and Their Design |
| 15 | -- | 25 | Pingqiang Zhou, Karthikk Sridharan, Sachin S. Sapatnekar. Optimizing Decoupling Capacitors in 3D Circuits for Power Grid Integrity |
| 26 | -- | 35 | Hsien-Hsin S. Lee, Krishnendu Chakrabarty. Test Challenges for 3D Integrated Circuits |
| 36 | -- | 47 | Hongbin Sun, Jibang Liu, Rakesh S. Anigundi, Nanning Zheng, Jian-Qiang Lu, Kenneth Rose, Tong Zhang. 3D DRAM Design and Application to 3D Multicore Systems |
| 48 | -- | 62 | Gordon W. Roberts, Sadok Aouini. Mixed-Signal Production Test: A Measurement Principle Perspective |
| 64 | -- | 73 | W. Robert Daasch, Glenn Shirley, Amit Nahar. Statistics in Semiconductor Test: Going beyond Yield |
| 74 | -- | 82 | Kenneth M. Butler, John M. Carulli Jr., Jayashree Saxena, Amit Nahar, W. Robert Daasch. Multidimensional Test Escape Rate Modeling |
| 83 | -- | 91 | Martin Ruckert, Axel Böttcher, Martin Hauser. A Generic Virtual Bus for Hardware Simulator Composition |
| 92 | -- | 104 | Hao Yu, Lei He, Mau-Chung Frank Chang. Robust On-Chip Signaling by Staggered and Twisted Bundle |
| 106 | -- | 107 | Grant Martin. Teaching someone to fish |
| 112 | -- | 0 | David S. Kung. The fate of stacking |