Journal: Proceedings of the IEEE

Volume 105, Issue 6

983 -- 984Marilyn Wolf, Dimitrios N. Serpanos. Safety and Security of Cyber-Physical and Internet of Things Systems [Point of View]
985 -- 989Thomas W. Crowe, William R. Deal, Michael Schroter, Ching-Kuang C. Tzuang, Ke Wu. Terahertz RF Electronics and System Integration [Scanning the Issue]
990 -- 1007Imran Mehdi, Jose V. Siles, Choonsup Lee, Erich Schlecht. THz Diode Technology: Status, Prospects, and Applications
1008 -- 1019Jan Stake, Aleksandra Malko, Tomas Bryllert, Josip Vukusic. Status and Prospects of High-Power Heterostructure Barrier Varactor Frequency Multipliers
1020 -- 1034Lei Liu, Syed M. Rahman, Zhenguo Jiang, Wenjun Li, Patrick Fay. Advanced Terahertz Sensing and Imaging Systems Based on Integrated III-V Interband Tunneling Devices
1035 -- 1050Pascal Chevalier, Michael Schröter, Colombo R. Bolognesi, Vincenzo d'Alessandro, Maria Alexandrova, Josef Bock, Ralf Flickiger, Sébastien Fregonese, Bernd Heinemann, C. Jungemann, Rickard Lovblom, Cristell Maneux, Olivier Ostinelli, Andreas Pawlak, Niccolò Rinaldi, Holger Rücker, Gerald Wedel, Thomas Zimmer. Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications
1051 -- 1067Miguel Urteaga, Zach Griffith, Munkyo Seo, Jonathan Hacker, Mark J. W. Rodwell. InP HBT Technologies for THz Integrated Circuits
1068 -- 1086Michael Schröter, Tommy Rosenbaum, Pascal Chevalier, Bernd Heinemann, Sorin P. Voinigescu, Ed Preisler, Josef Bock, Anindya Mukherjee. SiGe HBT Technology: Future Trends and TCAD-Based Roadmap
1087 -- 1104Sorin P. Voinigescu, Stefan Shopov, James Bateman, Hassan Farooq, James Hoffman, Konstantinos Vasilakopoulos. Silicon Millimeter-Wave, Terahertz, and High-Speed Fiber-Optic Device and Benchmark Circuit Scaling Through the 2030 ITRS Horizon
1105 -- 1120N. Scott Barker, Matthew F. Bauwens, Arthur W. Lichtenberger, Robert M. Weikle. Silicon-on-Insulator Substrates as a Micromachining Platform for Advanced Terahertz Circuits
1121 -- 1138Ho-Jin Song. Packages for Terahertz Electronics
1139 -- 1150Goutam Chattopadhyay, Theodore Reck, Choonsup Lee, Cecile Jung-Kubiak. Micromachined Packaging for Terahertz Systems
1151 -- 1165Mira Naftaly, Roland G. Clarke, David A. Humphreys, Nick M. Ridler. Metrology State-of-the-Art and Challenges in Broadband Phase-Sensitive Terahertz Measurements
1166 -- 1184Shi-Wei Qu, Huan Yi, Bao Jie Chen, Kung Bo Ng, Chi Hou Chan. Terahertz Reflecting and Transmitting Metasurfaces
1185 -- 1190Zoran Bojkovic, Bojan Bakmaz, Miodrag Bakmaz. Hamming Window to the Digital World