Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations

Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel. Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations. Microelectronics Journal, 38(4-5):463-473, 2007. [doi]

@article{AlamGTT07,
  title = {Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations},
  author = {Syed M. Alam and Chee Lip Gan and Carl V. Thompson and Donald E. Troxel},
  year = {2007},
  doi = {10.1016/j.mejo.2006.11.017},
  url = {http://dx.doi.org/10.1016/j.mejo.2006.11.017},
  tags = {analysis, reliability, design},
  researchr = {https://researchr.org/publication/AlamGTT07},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Journal},
  volume = {38},
  number = {4-5},
  pages = {463-473},
}