Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations

Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel. Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations. Microelectronics Journal, 38(4-5):463-473, 2007. [doi]

Abstract

Abstract is missing.