Chris C. N. Chu, Wai-Kei Mak. Flexible Packed Stencil Design With Multiple Shaping Apertures and Overlapping Shots for E-beam Lithography. IEEE Trans. on CAD of Integrated Circuits and Systems, 34(10):1652-1663, 2015. [doi]
@article{ChuM15,
title = {Flexible Packed Stencil Design With Multiple Shaping Apertures and Overlapping Shots for E-beam Lithography},
author = {Chris C. N. Chu and Wai-Kei Mak},
year = {2015},
doi = {10.1109/TCAD.2015.2427256},
url = {http://dx.doi.org/10.1109/TCAD.2015.2427256},
researchr = {https://researchr.org/publication/ChuM15},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {34},
number = {10},
pages = {1652-1663},
}