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Chris C. N. Chu, Wai-Kei Mak. Flexible Packed Stencil Design With Multiple Shaping Apertures and Overlapping Shots for E-beam Lithography. IEEE Trans. on CAD of Integrated Circuits and Systems, 34(10):1652-1663, 2015. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Flexible packed stencil design with multiple shaping apertures for e-beam lithographyChris Chu, Wai-Kei Mak. aspdac 2014: 137-142 [doi] E-Beam Lithography Character and Stencil Co-OptimizationWai-Kei Mak, Chris Chu. tcad, 33(5):741-751, 2014. [doi]
The following publications are possibly variants of this publication: