Thermal-aware cell and through-silicon-via co-placement for 3D ICs - researchr publication authors

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Jason Cong, Guojie Luo, Yiyu Shi. Thermal-aware cell and through-silicon-via co-placement for 3D ICs. In Leon Stok, Nikil D. Dutt, Soha Hassoun, editors, Proceedings of the 48th Design Automation Conference, DAC 2011, San Diego, California, USA, June 5-10, 2011. pages 670-675, ACM, 2011. [doi]

This author has not been identified. Look up 'Jason Cong' in GoogleIdentified as Guojie Luo This author has not been identified. Look up 'Yiyu Shi' in Google

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