Jason Cong, Guojie Luo, Yiyu Shi. Thermal-aware cell and through-silicon-via co-placement for 3D ICs. In Leon Stok, Nikil D. Dutt, Soha Hassoun, editors, Proceedings of the 48th Design Automation Conference, DAC 2011, San Diego, California, USA, June 5-10, 2011. pages 670-675, ACM, 2011. [doi]
@inproceedings{CongLS11,
title = {Thermal-aware cell and through-silicon-via co-placement for 3D ICs},
author = {Jason Cong and Guojie Luo and Yiyu Shi},
year = {2011},
doi = {10.1145/2024724.2024876},
url = {http://doi.acm.org/10.1145/2024724.2024876},
researchr = {https://researchr.org/publication/CongLS11},
cites = {0},
citedby = {0},
pages = {670-675},
booktitle = {Proceedings of the 48th Design Automation Conference, DAC 2011, San Diego, California, USA, June 5-10, 2011},
editor = {Leon Stok and Nikil D. Dutt and Soha Hassoun},
publisher = {ACM},
isbn = {978-1-4503-0636-2},
}