Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper - researchr publication authors

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Jacopo Franco, H. Arimura, J.-F. de Marneffe, A. Vandooren, L.-Å. Ragnarsson, Zhicheng Wu, Dieter Claes, E. Dentoni Litta, N. Horiguchi, Kris Croes, Dimitri Linten, Tibor Grasser, Ben Kaczer. Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper. In International Conference on IC Design and Technology, ICICDT 2021, Dresden, Germany, September 15-17, 2021. pages 1-4, IEEE, 2021. [doi]

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