Jacopo Franco, H. Arimura, J.-F. de Marneffe, A. Vandooren, L.-Å. Ragnarsson, Zhicheng Wu, Dieter Claes, E. Dentoni Litta, N. Horiguchi, Kris Croes, Dimitri Linten, Tibor Grasser, Ben Kaczer. Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper. In International Conference on IC Design and Technology, ICICDT 2021, Dresden, Germany, September 15-17, 2021. pages 1-4, IEEE, 2021. [doi]
@inproceedings{FrancoAMVRWCLHC21,
title = {Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper},
author = {Jacopo Franco and H. Arimura and J.-F. de Marneffe and A. Vandooren and L.-Å. Ragnarsson and Zhicheng Wu and Dieter Claes and E. Dentoni Litta and N. Horiguchi and Kris Croes and Dimitri Linten and Tibor Grasser and Ben Kaczer},
year = {2021},
doi = {10.1109/ICICDT51558.2021.9626482},
url = {https://doi.org/10.1109/ICICDT51558.2021.9626482},
researchr = {https://researchr.org/publication/FrancoAMVRWCLHC21},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {International Conference on IC Design and Technology, ICICDT 2021, Dresden, Germany, September 15-17, 2021},
publisher = {IEEE},
isbn = {978-1-6654-4998-4},
}