Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper - researchr publication related

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Jacopo Franco, H. Arimura, J.-F. de Marneffe, A. Vandooren, L.-Å. Ragnarsson, Zhicheng Wu, Dieter Claes, E. Dentoni Litta, N. Horiguchi, Kris Croes, Dimitri Linten, Tibor Grasser, Ben Kaczer. Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper. In International Conference on IC Design and Technology, ICICDT 2021, Dresden, Germany, September 15-17, 2021. pages 1-4, IEEE, 2021. [doi]

The following publications are possibly variants of this publication:

Novel Low Thermal Budget CMOS RMG: Performance and Reliability Benchmark Against Conventional High Thermal Budget Gate Stack SolutionsJacopo Franco, Hiroaki Arimura, J.-F. de Marneffe, S. Brus, Romain Ritzenthaler, E. Dentoni Litta, Kris Croes, Ben Kaczer, N. Horiguchi. vlsit 2023: 1-2 [doi]

Breakdown and reliability of p-MOS devices with stacked RPECVD oxide/nitride gate dielectric under constant voltage stressYi-Mu Lee, Yider Wu, Gerald Lucovsky. mr, 44(2):207-212, 2004. [doi]

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