Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing - researchr publication related

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Walid M. Hafez, P. Agnihotri, M. Asoro, M. Aykol, B. Bains, R. Bambery, M. Bapna, A. Barik, A. Chatterjee, P. C. Chiu, T. Chu, C. Firby, K. Fischer, M. Fradkin, Hannes Greve, A. Gupta, E. Haralson, M. Haran, Jeffery Hicks, A. Illa, M. Jang, S. Klopcic, M. Kobrinsky, B. Kuns, H.-h. Lai, G. Lanni, S.-H. Lee, N. Lindert, C. L. Lo, Y. Luo, G. Malyavanatham, B. Marinkovic, Y. Maymon, M. Nabors, J. Neirynck, P. Packan, A. Paliwal, L. Pantisano, Leif Paulson, Padma Penmatsa, Chetan Prasad, C. Puls, T. Rahman, R. Ramaswamy, S. Samant, B. Sell, K. Sethi, F. Shah, M. Shamanna, K. Shang, Q. Li, M. Sibakoti, J. Stoeger, N. Strutt, R. Thirugnanasambandam, C. Tsai, X. Wang, A. Wang, S. J. Wu, Q. Xu, X.-h. Zhong, S. Natarajan. Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]

The following publications are possibly variants of this publication:

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