Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi. Fault isolation of short defect in through silicon via (TSV) based 3D-IC. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]
@inproceedings{JungCKKKKBC13,
title = {Fault isolation of short defect in through silicon via (TSV) based 3D-IC},
author = {Daniel H. Jung and Jonghyun Cho and Heegon Kim and Jonghoon J. Kim and Hongseok Kim and Joungho Kim and Hyun-Cheol Bae and Kwang-Seong Choi},
year = {2013},
doi = {10.1109/3DIC.2013.6702376},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702376},
researchr = {https://researchr.org/publication/JungCKKKKBC13},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}