The following publications are possibly variants of this publication:
- Fault detection and isolation of multiple defects in through silicon via (TSV) channelDaniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi. 3dic 2014: 1-5 [doi]
- Modeling and analysis of open defect in through silicon via (TSV) channelDaniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi. emccompo 2013: 163-166 [doi]
- Modeling and analysis of defects in through silicon via channel for non-invasive fault isolationDaniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi. 3dic 2015: [doi]